QMS Installs New Nitrogen Purge SMT Reflow Oven Capability

February 7, 2015

QMS is pleased to announce the implementation of Nitrogen Purge SMT Reflow Oven capability, keeping QMS at the leading edge of the high-tech Electronic Manufacturing Services industry. This enhanced capability enables QMS to ensure defect-free, textbook SMT solder reflow on the most advanced electronic components specified in today’s demanding manufacturing requirements.